Invention Grant
- Patent Title: Workpiece supporting device and workpiece supporting method
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Application No.: US16971297Application Date: 2019-02-14
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Publication No.: US11618133B2Publication Date: 2023-04-04
- Inventor: Jun Eto , Manabu Hayashi , Osamu Katsuchi
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Kanesaka Berner and Partners LLP
- Priority: JPJP2018-031059 20180223
- International Application: PCT/JP2019/005236 WO 20190214
- International Announcement: WO2019/163620 WO 20190829
- Main IPC: B25B11/00
- IPC: B25B11/00

Abstract:
The purpose of the present invention is to facilitate bonding between a jig and a plate-shaped workpiece and to suitably support the workpiece. A support device is provided with: a jig that has a bent support surface for supporting a plate-shaped workpiece; a first abutment that abuts against one end of the workpiece mounted on the support surface; and a second abutment that is disposed so as to face the first abutment across the support surface and that abuts against the other end of the workpiece mounted on the support surface. The first and second abutments move toward each other and apply a load, in the tangential direction load of the support surface, with respect to the workpiece mounted on the support surface.
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