Invention Grant
- Patent Title: Method of cleaning, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
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Application No.: US16573554Application Date: 2019-09-17
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Publication No.: US11618947B2Publication Date: 2023-04-04
- Inventor: Kazuhiro Harada , Shingo Nohara , Yuji Urano , Yasunobu Koshi , Masayoshi Minami
- Applicant: KOKUSAI ELECTRIC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee: KOKUSAI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Volpe Koenig
- Priority: JPJP2018-178942 20180925
- Main IPC: C23C16/44
- IPC: C23C16/44 ; C23C16/52 ; H01L21/67

Abstract:
There is provided a technique of cleaning an inside of a process container, including: (a) removing substances adhered in a process container set at a first temperature by supplying a first gas at a first flow rate into the process container and exhausting the inside of the process container; (b) physically desorbing and removing residual fluorine in the process container set at a second temperature by supplying a second gas at a second flow rate into the process container and exhausting the inside of the process container; and (c) chemically desorbing and removing residual fluorine in the process container set at a third temperature by supplying a third gas at a third flow rate into the process container and exhausting the inside of the process container.
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Information query
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