Invention Grant
- Patent Title: Heat exchanger and heat pump system having same
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Application No.: US17885168Application Date: 2022-08-10
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Publication No.: US11619427B2Publication Date: 2023-04-04
- Inventor: Yutaka Shibata , Mitsuharu Numata , Tomoki Hirokawa , Hirokazu Fujino
- Applicant: DAIKIN INDUSTRIES, LTD.
- Applicant Address: JP Osaka
- Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Osha Bergman Watanabe & Burton LLP
- Priority: JPJP2020-021017 20200210
- Main IPC: F28F3/00
- IPC: F28F3/00 ; F25B39/00 ; F28D9/00 ; F28F9/22

Abstract:
A heat exchanger includes: first layers each including first flow channels that are microchannels; and second layers each including second flow channels that are microchannels. The first layers and the second layers constitute a lamination. Heat is exchanged by performing either of: liquid evaporation in the first flow channels and gas condensation in the second flow channels, or liquid evaporation in the second flow channels and gas condensation in the first flow channels. The lamination includes: a first liquid transport pore that is in fluid communication with the first flow channels; and a second liquid transport pore that is in fluid communication with the second flow channels.
Public/Granted literature
- US20220381487A1 HEAT EXCHANGER AND HEAT PUMP SYSTEM HAVING SAME Public/Granted day:2022-12-01
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