Invention Grant
- Patent Title: Thermal controller, thermal control system and thermal control method for hardware devices
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Application No.: US17247460Application Date: 2020-12-11
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Publication No.: US11619457B2Publication Date: 2023-04-04
- Inventor: Fei Wang
- Applicant: Hand Held Products, Inc.
- Applicant Address: US NC Charlotte
- Assignee: Hand Held Products, Inc.
- Current Assignee: Hand Held Products, Inc.
- Current Assignee Address: US NC Charlotte
- Agency: Alston & Bird LLP
- Priority: CN202011319344.0 20201123
- Main IPC: F28F27/00
- IPC: F28F27/00 ; F28F13/00 ; F28F3/00

Abstract:
Embodiments of the disclosure relate generally to thermal control and management in hardware devices. A thermal control system includes a thermal node, a thermal bridge, and a thermal controller. The thermal node is configured to receive heat generated in a device. The thermal controller is configured to in response to an environment temperature of the thermal controller being greater than a first threshold temperature, cause heat transfer from the thermal node to a first heat sink and prevent heat transfer from the thermal node to a second heat sink. The thermal controller is also configured to, in response to the environment temperature of the thermal controller being greater than a second threshold temperature, cause heat transfer from the thermal node to the second heat sink and prevent heat transfer from the thermal node to the first heat sink.
Public/Granted literature
- US20220163273A1 THERMAL CONTROLLER, THERMAL CONTROL SYSTEM AND THERMAL CONTROL METHOD FOR HARDWARE DEVICES Public/Granted day:2022-05-26
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