Invention Grant
- Patent Title: 3D flow compensated interleaved epi in combination with swapped readout
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Application No.: US17348927Application Date: 2021-06-16
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Publication No.: US11619696B2Publication Date: 2023-04-04
- Inventor: Wei Liu , Kun Zhou
- Applicant: Siemens Healthcare GmbH
- Applicant Address: DE Erlangen
- Assignee: Siemens Healthcare GmbH
- Current Assignee: Siemens Healthcare GmbH
- Current Assignee Address: DE Erlangen
- Agency: Banner & Witcoff Ltd.
- Priority: CN202010552018.8 20200617
- Main IPC: G01R33/561
- IPC: G01R33/561 ; G01R33/56 ; G01R33/565

Abstract:
The disclosure relates to a fast susceptibility imaging techniques for performing flow compensations in the slice, phase, and frequency encoding directions for the central echo of a plurality of echoes excited each time in interleaved echo planar imaging (iEPI). The echo data for which flow compensations have been performed may be collected, and susceptibility-weighted imaging (SWI) performed for collected echo data. The fast susceptibility imaging techniques may reduce scan time.
Public/Granted literature
- US20210396827A1 3D FLOW COMPENSATED INTERLEAVED EPI IN COMBINED WITH SWAPPED READOUT Public/Granted day:2021-12-23
Information query
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