Invention Grant
- Patent Title: Method of manufacturing a semiconductor device for attaching to a flexible display
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Application No.: US17235235Application Date: 2021-04-20
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Publication No.: US11619974B2Publication Date: 2023-04-04
- Inventor: Cheng-Hao Huang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT Law
- Agent Anthony King
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G09F9/30 ; H01L21/822 ; H01L51/56 ; H01L51/52 ; H01L51/00 ; G02F1/1345 ; H01L27/32 ; H01L23/00

Abstract:
A method of manufacturing a flexible display includes providing a substrate having a first and second pad density areas and a pair of long sides; forming conductive pads on the substrate, each of the conductive pad is free of right angle and in a shape of parallelogram, and a pad density of the second pad density area is higher than that of the first pad density area; providing a flexible substrate; and bonding the conductive pads to a conductor of a circuit of the flexible substrate. Each of the conductive pad has long sides and short sides, a portion of the conductive pads have the long sides sloped away from the first pad density area and toward one long side of the substrate, and the rest of the conductive pads have the long sides sloped away the first pad density area and toward the other long side of the substrate.
Public/Granted literature
- US20210240227A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE FOR ATTACHING TO A FLEXIBLE DISPLAY Public/Granted day:2021-08-05
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