Invention Grant
- Patent Title: Electronic device chassis with expansion card brackets
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Application No.: US17606069Application Date: 2019-07-30
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Publication No.: US11619980B2Publication Date: 2023-04-04
- Inventor: Tien Liang Chung
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Quarles & Brady LLP
- International Application: PCT/US2019/044187 WO 20190730
- International Announcement: WO2021/021137 WO 20210204
- Main IPC: G06F1/18
- IPC: G06F1/18 ; H05K5/02

Abstract:
In an example, an electronic device chassis may include a back panel and an expansion card bracket which may be attached or attachable to the back panel. The expansion card bracket may include a bracket body, a lock feature to engage with an expansion card of the electronic device, and a retention loop extending from the bracket body to receive a portion of a peripheral device to lock the peripheral device to the chassis.
Public/Granted literature
- US20220214726A1 ELECTRONIC DEVICE CHASSIS WITH EXPANSION CARD BRACKETS Public/Granted day:2022-07-07
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