Invention Grant
- Patent Title: Low latency inter-chip communication mechanism in a multi-chip processing system
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Application No.: US17400959Application Date: 2021-08-12
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Publication No.: US11620223B2Publication Date: 2023-04-04
- Inventor: Craig Barner , David Asher , Richard Kessler , Bradley Dobbie , Daniel Dever , Thomas F. Hummel , Isam Akkawi
- Applicant: Marvell Asia Pte, Ltd.
- Applicant Address: SG Singapore
- Assignee: Marvell Asia Pte, Ltd.
- Current Assignee: Marvell Asia Pte, Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: G06F12/00
- IPC: G06F12/00 ; G06F12/084 ; G06F12/0842 ; G06F12/0813

Abstract:
Systems and methods of multi-chip processing with low latency and congestion. In a multi-chip processing system, each chip includes a plurality of clusters arranged in a mesh design. A respective interconnect controller is disposed at the end of each column. The column is linked to a corresponding remote column in the other chip. A share cache controller in the column is paired with a corresponding cache controller in the remote column, the pair of cache controllers are configured to control data caching for a same set of main memory locations. Communications between cross-chip cache controllers are performed within linked columns of clusters via the column-specific inter-chip interconnect controllers.
Public/Granted literature
- US20210374057A1 LOW LATENCY INTER-CHIP COMMUNICATION MECHANISM IN A MULTI-CHIP PROCESSING SYSTEM Public/Granted day:2021-12-02
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