Invention Grant
- Patent Title: Neuromorphic package devices and neuromorphic computing systems
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Application No.: US16881963Application Date: 2020-05-22
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Publication No.: US11620505B2Publication Date: 2023-04-04
- Inventor: Jaehun Jang , Hongrak Son , Changkyu Seol , Pilsang Yoon , Junghyun Hong
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2019-0134618 20191028
- Main IPC: G06N3/063
- IPC: G06N3/063 ; G11C11/54 ; G06N3/04 ; G11C13/00

Abstract:
A neuromorphic package device includes a systolic array package and a controller. The systolic array package includes neuromorphic chips arranged in a systolic array along a first direction and a second direction. The controller communicates with a host controls the neuromorphic chips. Each of the neuromorphic chips sequentially transfers weights of a plurality layers of a neural network system in the first direction to store the weights. A first neuromorphic chip performs a calculation based on stored weights therein and an input data received in the second direction, and provides a result of the calculation to at least one of a second neuromorphic chip and a third neuromorphic chip which are adjacent to the first neuromorphic chip. The at least one of the second and third neuromorphic chips performs a calculation based on a provided result of the calculation and stored weights therein.
Public/Granted literature
- US20210125048A1 NEUROMORPHIC PACKAGE DEVICES AND NEUROMORPHIC COMPUTING SYSTEMS Public/Granted day:2021-04-29
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