An ultrasonic transducer is disclosed. The ultrasonic transducer includes a stainless steel backing comprising a piezoelectric element mounted on a front face of the backing, wherein the stainless steel backing enables operation in high temperature and radiation applications. The ultrasonic transducer further includes a first enclosure comprising a threaded through hole and a second enclosure comprising an opening, wherein the first and second enclosure encapsulates the stainless steel backing, wherein the first enclosure and the second enclosure are joined together using a plurality of enclosure screws, wherein the first enclosure is configured to receive a set screw through the threaded through hole, and wherein the set screw upon being received is configured to make contact with a ceramic ball, and wherein tightening of the set screw pushes the piezoelectric element out of the opening in the second enclosure to make a contact with a work structure.