Invention Grant
- Patent Title: Semiconductor device having a reduced footprint of wires connecting a DLL circuit with an input/output buffer
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Application No.: US16230699Application Date: 2018-12-21
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Publication No.: US11621032B2Publication Date: 2023-04-04
- Inventor: Shingo Tajima
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dorsey & Whitney LLP
- Priority: JP2013-132800 20130625
- Main IPC: G11C11/4076
- IPC: G11C11/4076 ; G11C11/408 ; G06F1/10 ; G11C7/10 ; G11C7/22

Abstract:
An apparatus includes a clock terminal configured to receive an external clock signal, a clock generator configured to generate an internal clock signal in response to the external clock signal, first and second output circuits each coupled to the clock generator, a first clock line coupled between the clock generator and the first output circuit, and the second clock line coupled between the clock generator and the second output circuit. The first clock line represents a first capacitance and a first resistance while the second clock line represents a second capacitance and a second resistance. A first value defined as the product of the first capacitance and the first resistance is substantially equal to a second value defined as the product of the second capacitance and the second resistance.
Public/Granted literature
Information query
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