Invention Grant
- Patent Title: Upper electrode and plasma processing apparatus
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Application No.: US17052020Application Date: 2019-04-26
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Publication No.: US11621151B2Publication Date: 2023-04-04
- Inventor: Hachishiro Iizuka
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Fenwick & West LLP
- Priority: JPJP2018-088686 20180502
- International Application: PCT/JP2019/018147 WO 20190426
- International Announcement: WO2019/212059 WO 20191107
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01J37/32 ; C23C16/455 ; C23C16/458 ; C23C16/50

Abstract:
An upper electrode includes a central electrode, a peripheral electrode, multiple dielectric bodies, and multiple power supply electrodes. The central electrode is disposed on a counter surface of the upper electrode facing a substrate support, on which a target object that is a plasma processing target is placed, at a position corresponding to a central portion of the substrate support. The peripheral electrode is disposed on the counter surface to encircle a periphery of the central electrode. The dielectric bodies are laminated between the counter surface and a surface of the upper electrode opposite to the counter surface. The power supply electrode is arranged between the dielectric bodies to electrically connect the central electrode and the peripheral electrode respectively to power supply terminals individually disposed at the surface opposite to the counter surface.
Public/Granted literature
- US20210142989A1 UPPER ELECTRODE AND PLASMA PROCESSING APPARATUS Public/Granted day:2021-05-13
Information query
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