Systems are described. A system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane. The substrate has a top surface, a bottom surface and side surfaces. At least one bond pad is provided on the bottom surface of the substrate. A metal layer is provided on the bottom surface of the substrate and the bottom surface of the silicon backplane and has a first portion electrically and thermally coupled to the bottom surface of the silicon backplane in a central region and second portions that extend between a perimeter region of the silicon backplane and the at least one bond pad. An array of metal connectors is provided on the top surface of the silicon backplane.