Invention Grant
- Patent Title: Substrate processing apparatus and irradiation position adjusting method
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Application No.: US16874730Application Date: 2020-05-15
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Publication No.: US11621179B2Publication Date: 2023-04-04
- Inventor: Satoshi Suzuki
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JPJP2019-092785 20190516
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/3065 ; H01L21/304 ; H01L21/677 ; H01L21/683

Abstract:
A substrate processing apparatus includes a placing table, having a first placing surface on which a substrate is placed and a rear surface opposite to the first placing surface, provided with a first window which allows the first placing surface and the rear surface to communicate with each other and which is configured to transmit light; a first adjusting device configured to hold a first light irradiation unit configured to irradiate light toward the first window and configured to adjust an irradiation position of the light on the rear surface; and a first reflection member, having retroreflection property, disposed at the rear surface of the placing table to enclose the first window, and configured to reflect a part of the light and return reflection light indicating a deviation between the irradiation position of the light and a position of the first window to the first light irradiation unit.
Information query
IPC分类: