A molding system for molding electronic components mounted on first and second sides of a substrate has a molding cavity onto which the substrate is locatable for molding. The molding cavity has a first section covering a molding portion of the first side of the substrate, and a second section covering a molding portion of the second side of the substrate. First and second pots have plungers for compressing molding compound placed therein. First and second runners connect the first and second pots to the first and second sections of the molding cavity for introducing the molding compound onto both sides of the substrate. In particular, the runners extend at least from an edge of the substrate along both sides of the substrate to the molding cavity.