Invention Grant
- Patent Title: Semiconductor device and manufacturing method of the semiconductor device
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Application No.: US17020011Application Date: 2020-09-14
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Publication No.: US11621274B2Publication Date: 2023-04-04
- Inventor: Kang Sik Choi
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si
- Agency: William Park & Associates Ltd.
- Priority: KR10-2018-0029360 20180313
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L21/764 ; H01L27/1157 ; H01L29/06 ; H01L21/768

Abstract:
A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a well structure, a first channel pillar and a second channel pillar extending from an inside of the well structure in an upward direction, a semiconductor pattern coupled between the first channel pillar and the second channel pillar and having a gap disposed in a central region of the semiconductor pattern, and a source junction formed in the semiconductor pattern.
Public/Granted literature
- US11587946B2 Semiconductor device and manufacturing method of the semiconductor device Public/Granted day:2023-02-21
Information query
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