Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17389024Application Date: 2021-07-29
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Publication No.: US11621320B2Publication Date: 2023-04-04
- Inventor: Yasuyuki Hoshi
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Agency: Rabin & Berdo, P.C.
- Priority: JPJP2020-147932 20200903
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78

Abstract:
A main semiconductor device element is SiC-MOSFETs with a trench gate structure, the main semiconductor device element having main MOS regions responsible for driving the MOSFETs and main SBD regions that are regions responsible for SBD operation. The main MOS regions and the main SBD regions are adjacent to one another and each pair of a main MOS region and a main SBD region adjacent thereto share one trench. In the main SBD regions, first and second p-type regions, and Schottky electrodes at the front surface of the semiconductor substrate and forming Schottky junctions with an n−-type drift region are provided. The first p-type regions are provided along sidewalls of the trenches, in contact with the first p+-type regions at the bottoms of the trenches. The second p-type regions are provided between the first p-type regions and the Schottky electrodes, and are electrically connected to these regions.
Public/Granted literature
- US20220069072A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-03-03
Information query
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