Invention Grant
- Patent Title: Semiconductor device, ferroelectric capacitor and laminated structure
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Application No.: US17160013Application Date: 2021-01-27
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Publication No.: US11621337B2Publication Date: 2023-04-04
- Inventor: Ying-Chih Chen , Blanka Magyari-Kope
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT Law
- Agent Anthony King
- Main IPC: H01L29/51
- IPC: H01L29/51 ; H01L29/78 ; H01L49/02

Abstract:
A semiconductor device includes a substrate, a gate stack over the substrate, a channel layer over the gate stack, and a source/drain electrode. The gate stack includes a metal gate electrode, a ferroelectric layer, and a semiconducting oxide layer disposed between the ferroelectric layer and the metal gate electrode. The source/drain electrode is formed on the channel layer and disposed on sides of the gate stack.
Public/Granted literature
- US20220238690A1 SEMICONDUCTOR DEVICE, FERROELECTRIC CAPACITOR AND LAMINATED STRUCTURE Public/Granted day:2022-07-28
Information query
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