Invention Grant
- Patent Title: Semiconductor device, method, and tool of manufacture
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Application No.: US17068578Application Date: 2020-10-12
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Publication No.: US11621342B2Publication Date: 2023-04-04
- Inventor: Chih Hung Chen , Kei-Wei Chen , Ying-Lang Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/40 ; H01L21/67 ; H01L21/321 ; B24B37/00 ; B24B37/10 ; B24B7/22 ; H01L29/08
Abstract:
In an embodiment, a method includes: performing a self-limiting process to modify a top surface of a wafer; after the self-limiting process completes, removing the modified top surface from the wafer; and repeating the performing the self-limiting process and the removing the modified top surface from the wafer until a thickness of the wafer is decreased to a predetermined thickness.
Public/Granted literature
- US20210036129A1 Semiconductor Device, Method, and Tool of Manufacture Public/Granted day:2021-02-04
Information query
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