Invention Grant
- Patent Title: Isolation device and method of transmitting a signal across an isolation material using wire bonds
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Application No.: US16936123Application Date: 2020-07-22
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Publication No.: US11621364B2Publication Date: 2023-04-04
- Inventor: Kok Keong Richard Lum , Hong Sia Tan
- Applicant: MPICS INNOVATIONS PTE. LTD
- Applicant Address: SG Singapore
- Assignee: MPICS INNOVATIONS PTE. LTD
- Current Assignee: MPICS INNOVATIONS PTE. LTD
- Current Assignee Address: SG Singapore
- Agency: Sheridan Ross P.C.
- Main IPC: H01L31/173
- IPC: H01L31/173 ; H01L23/00 ; H01L31/02 ; H01L25/065 ; H01L23/64 ; H02J50/10

Abstract:
An isolation system and isolation device are disclosed. An illustrative isolation device is disclosed to include a transmitter circuit, a detector circuit, a first wire bond, and a second wire bond. The detector circuit is configured to generate a first current in accordance with a first signal. The first wire bond is configured to receive the first current from the transmitter circuit to generate a magnetic flux. The second wire bond is configured to receive the magnetic flux. An induced current in the second wire bond is then detected in the detector circuit. The detector circuit is configured to generate a reproduced first signal, as an output of the detector circuit.
Public/Granted literature
- US20220029043A1 ISOLATION DEVICE AND METHOD OF TRANSMITTING A SIGNAL ACROSS AN ISOLATION MATERIAL USING WIRE BONDS Public/Granted day:2022-01-27
Information query
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