Invention Grant
- Patent Title: Radio assembly with modularized radios and interconnects
-
Application No.: US16918319Application Date: 2020-07-01
-
Publication No.: US11621481B2Publication Date: 2023-04-04
- Inventor: Brian Lehman , Thomas Burn , Scott Mason , David Pell , Jianjun An , Mårten Skoger
- Applicant: Telefonaktiebolaget LM Ericsson (publ)
- Applicant Address: SE Stockholm
- Assignee: Telefonaktiebolaget LM Ericsson (publ)
- Current Assignee: Telefonaktiebolaget LM Ericsson (publ)
- Current Assignee Address: SE Stockholm
- Agency: Christopher & Weisberg, P.A.
- Main IPC: H01Q1/42
- IPC: H01Q1/42 ; H04W76/40 ; H01Q1/24 ; H01Q5/30 ; H01Q21/00 ; H01Q21/26 ; H01Q25/00 ; H01Q1/02 ; H01Q9/16
Abstract:
A radio assembly is provided. The radio assembly includes at least one radio module and a radome. The radio module has a heatsink disposed on one side and a radio module base on the other side thereof. The radio module base is disposed between the heatsink and the radome. The heatsink defines a cable channel for routing at least one power cable and at least one data cable.
Public/Granted literature
- US20200335863A1 RADIO ASSEMBLY WITH MODULARIZED RADIOS AND INTERCONNECTS Public/Granted day:2020-10-22
Information query
