Invention Grant
- Patent Title: Antenna manufacturing method and antenna device
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Application No.: US17615840Application Date: 2019-06-24
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Publication No.: US11621482B2Publication Date: 2023-04-04
- Inventor: Kei Yokokawa , Narihiro Nakamoto , Toru Fukasawa , Hitoshi Arai , Tomohiro Takahashi , Kensuke Iwaki , Takamichi Kono , Keisuke Fujiwara
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Xsensus LLP
- International Application: PCT/JP2019/024949 WO 20190624
- International Announcement: WO2020/261332 WO 20201230
- Main IPC: H01Q1/42
- IPC: H01Q1/42 ; H01Q9/04 ; H01Q21/00 ; H01Q21/06
Abstract:
A conductor ground plane provided on a dielectric substrate and provided with a patch antenna and a conductor ground plane provided on the side of a dielectric substrate having a through hole are bonded by solder in a state where the through hole and the patch antenna are arranged to face each other, and a conductor ground plane provided on the back side of the dielectric substrate and a conductor ground plane provided on a dielectric substrate are bonded by solder.
Public/Granted literature
- US20220209402A1 ANTENNA MANUFACTURING METHOD AND ANTENNA DEVICE Public/Granted day:2022-06-30
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