Invention Grant
- Patent Title: Electrical power connector configured for high current density
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Application No.: US17208819Application Date: 2021-03-22
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Publication No.: US11621511B2Publication Date: 2023-04-04
- Inventor: Charles Copper , Christopher J. Kolivoski , Hung Viet Ngo , Thomas A. Brungard
- Applicant: FCI USA LLC
- Applicant Address: US PA Etters
- Assignee: FCI USA LLC
- Current Assignee: FCI USA LLC
- Current Assignee Address: US PA Etters
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01R12/72
- IPC: H01R12/72 ; H01R12/70 ; H01R13/02

Abstract:
An electrical power interconnection system is described. The electrical interconnection system may comprise an electrical power connector and a substrate, such as a printed circuit board. The electrical power connector may comprise a housing and a plurality of electrical power contacts supported by the housing. The electrical power contacts may comprise a mounting end, a mating end, and a contact body disposed between the mounting end and the mating end. The electrical power contacts may have planar portions. The mating ends may comprise opposing first second beams defining a slot. The slot may be configured to receive the substrate therein, such that the first beam contacts the first side of the substrate and the second beam contacts the second side of the substrate.
Public/Granted literature
- US20210210881A1 ELECTRICAL POWER CONNECTOR CONFIGURED FOR HIGH CURRENT DENSITY Public/Granted day:2021-07-08
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