Invention Grant
- Patent Title: Power amplifier packages and systems incorporating design-flexible package platforms
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Application No.: US16830787Application Date: 2020-03-26
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Publication No.: US11621673B2Publication Date: 2023-04-04
- Inventor: Jean-Christophe Nanan , David James Dougherty , Scott Duncan Marshall , Lakshminarayan Viswanathan , Xavier Hue
- Applicant: NXP USA, Inc.
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Priority: EP19305473 20190412
- Main IPC: H03F3/14
- IPC: H03F3/14 ; H03F1/02 ; H01L23/66 ; H01L23/00 ; H01L25/065 ; H03F3/21

Abstract:
Embodiments of Doherty Power Amplifier (PA) and other PA packages are provided, as are systems including PA packages. In embodiments, the PA package includes a package body having a longitudinal axis, a first group of input-side leads projecting from a first side of the package body and having an intra-group lead spacing, and a first group of output-side leads projecting from a second side of the package body and also having the intra-group lead spacing. A first carrier input lead projects from the first package body side and is spaced from the first group of input-side leads by an input-side isolation gap, which has a width exceeding the intra-group lead spacing. Similarly, a first carrier output lead projects from the second package body side, is laterally aligned with the first carrier input lead, and is separated from the first group of output-side leads by an output-side isolation gap.
Public/Granted literature
- US20200328721A1 POWER AMPLIFIER PACKAGES AND SYSTEMS INCORPORATING DESIGN-FLEXIBLE PACKAGE PLATFORMS Public/Granted day:2020-10-15
Information query
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