Invention Grant
- Patent Title: Acoustic wave device
-
Application No.: US17704519Application Date: 2022-03-25
-
Publication No.: US11621688B2Publication Date: 2023-04-04
- Inventor: Takashi Yamane , Tetsuya Kimura , Sho Nagatomo , Katsuya Daimon , Hideki Iwamoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2019-178097 20190927
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/13 ; H03H9/17 ; H03H9/56

Abstract:
An acoustic wave device includes a piezoelectric layer and first and second electrodes. The first and second electrodes face each other in a direction intersecting with a thickness direction of the piezoelectric layer. The acoustic wave device uses a bulk wave of a thickness-shear primary mode. A material of the piezoelectric layer is lithium niobate or lithium tantalate. The piezoelectric layer is on a first main surface of the silicon substrate. The acoustic wave device further includes a trap region on a side of a second main surface of the piezoelectric layer.
Public/Granted literature
- US20220216844A1 ACOUSTIC WAVE DEVICE Public/Granted day:2022-07-07
Information query