Invention Grant
- Patent Title: Optimizations to support enhanced handover procedures
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Application No.: US16993171Application Date: 2020-08-13
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Publication No.: US11622309B2Publication Date: 2023-04-04
- Inventor: Karthika Paladugu , Xipeng Zhu , Tom Chin
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Patterson + Sheridan, L.L.P.
- Main IPC: H04W36/18
- IPC: H04W36/18 ; H04W36/32 ; H04W36/08
Abstract:
Aspects of the present disclosure relate to wireless communications, and more particularly, techniques that may help optimize enhanced handover procedures, such as MBB and CHO handover procedures.
Public/Granted literature
- US20210051554A1 OPTIMIZATIONS TO SUPPORT ENHANCED HANDOVER PROCEDURES Public/Granted day:2021-02-18
Information query
