Invention Grant
- Patent Title: Relay of superpositioned sidelink and uplink transmission
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Application No.: US16951788Application Date: 2020-11-18
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Publication No.: US11622402B2Publication Date: 2023-04-04
- Inventor: Anantharaman Balasubramanian , Sony Akkarakaran , Shuanshuan Wu , Kapil Gulati
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Main IPC: H04W76/15
- IPC: H04W76/15 ; H04L1/18 ; H04W68/00 ; H04L1/00 ; H04W72/04 ; H04W80/02 ; H04L5/00 ; H04W76/27 ; H04L1/1867 ; H04W72/0446

Abstract:
Apparatus, methods, and computer-readable media for facilitating relay of superpositioned sidelink and uplink transmission are disclosed herein. An example method for wireless communication at a first communication device includes receiving, from a UE, a MUST transmission including a base layer and an enhancement layer, the base layer comprising a first message for a second communication device and the enhancement layer comprising a second message for the first communication device. The example method also includes decoding the base layer of the MUST transmission to obtain the first message. Additionally, the example method includes receiving a feedback message from the second communication device indicating that the second communication device did not successfully receive the first message. The example method also includes retransmitting the first message to the second communication device in response to the feedback message from the second communication device.
Public/Granted literature
- US20220159757A1 RELAY OF SUPERPOSITIONED SIDELINK AND UPLINK TRANSMISSION Public/Granted day:2022-05-19
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