Invention Grant
- Patent Title: Flexible circuit board, COF module and electronic device including the same
-
Application No.: US17836405Application Date: 2022-06-09
-
Publication No.: US11622444B2Publication Date: 2023-04-04
- Inventor: Jun Young Lim , Woong Sik Kim , Hyung Kyu Yoon , Min Hwan Kim
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates, LLP
- Priority: KR10-2016-0093748 20160722,KR10-2016-0102902 20160812
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/28 ; H01L23/498 ; H01L23/00 ; H01L21/48 ; H05K1/14 ; H05K3/18 ; H05K1/18

Abstract:
A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.
Public/Granted literature
- US20220304146A1 FLEXIBLE CIRCUIT BOARD, COF MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2022-09-22
Information query