In a multilayer ceramic capacitor, an interposer includes, on a side of a first external electrode in a length direction, a first through hole that penetrates the interposer in a stacking direction, and provides electrical conduction between a first joining electrode and a first mounting electrode. The first through hole further includes a first metal film provided on an inner wall thereof. The interposer includes, on a side of a second external electrode in the length direction, a second through hole that penetrates the interposer in the stacking direction, and provides electrical conduction between a second joining electrode and a second mounting electrode. The second through hole further includes a second metal film provided on an inner wall thereof. A first uncovered portion is provided, which is not covered by the first metal film, on a first surface of the inner wall of the first through hole, and a second uncovered portion is provided which is not covered by a second metal film on the first surface of the inner wall of the second through hole.