Invention Grant
- Patent Title: Systems and methods for solder paste printing on components
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Application No.: US17247981Application Date: 2021-01-04
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Publication No.: US11622451B2Publication Date: 2023-04-04
- Inventor: Ziv Gilan , Michael Zenou
- Applicant: IO Tech Group Ltd.
- Applicant Address: GB London
- Assignee: IO Tech Group Ltd.
- Current Assignee: IO Tech Group Ltd.
- Current Assignee Address: GB London
- Agency: Ascenda Law Group, PC
- Main IPC: H05K3/34
- IPC: H05K3/34 ; H05K3/12

Abstract:
Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an electronic component at a first printing unit, and the electronic component is subsequently placed onto a substrate with the portions of viscous material between the electronic component and the substrate. Optionally, a printing unit which prints the dots of material onto the electronic component includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the electronic component by the printing unit. The system may also include imaging units to aid in the overall process.
Public/Granted literature
- US20210267067A1 SYSTEMS AND METHODS FOR SOLDER PASTE PRINTING ON COMPONENTS Public/Granted day:2021-08-26
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