Invention Grant
- Patent Title: Electromagnetic wave absorber and electromagnetic wave absorber-attached molded article
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Application No.: US16621078Application Date: 2018-03-27
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Publication No.: US11622482B2Publication Date: 2023-04-04
- Inventor: Kazuto Yamagata , Hironobu Machinaga , Yuuki Takeda , Hiroichi Ukei , Takehiro Ui
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki
- Agency: WHDA, LLP
- Priority: JPJP2017-116296 20170613
- International Application: PCT/JP2018/012602 WO 20180327
- International Announcement: WO2018/230092 WO 20181220
- Main IPC: H05K9/00
- IPC: H05K9/00 ; B32B7/025 ; B32B15/08 ; B32B7/06

Abstract:
An electromagnetic wave absorber (1) includes a dielectric layer (10), a resistive layer (20), and an electrically conductive layer (30). The resistive layer (20) is disposed on one principal surface of the dielectric layer (10). The electrically conductive layer (30) is disposed on the other principal surface of the dielectric layer (10) and has a sheet resistance lower than a sheet resistance of the resistive layer (20). The resistive layer (20) is a layer that includes tin oxide or titanium oxide as a main component or a layer that is made of indium tin oxide including 40 weight % or more of tin oxide.
Public/Granted literature
- US20200214181A1 ELECTROMAGNETIC WAVE ABSORBER AND ELECTROMAGNETIC WAVE ABSORBER-ATTACHED MOLDED ARTICLE Public/Granted day:2020-07-02
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