Invention Grant
- Patent Title: Resin impregnation measurement device
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Application No.: US16718406Application Date: 2019-12-18
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Publication No.: US11623374B2Publication Date: 2023-04-11
- Inventor: Keisuke Tajiri
- Applicant: SUBARU CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SUBARU CORPORATION
- Current Assignee: SUBARU CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Troutman Pepper Hamilton Sanders LLP
- Priority: JPJP2018-246725 20181228
- Main IPC: B29C70/54
- IPC: B29C70/54 ; G01F23/263 ; B29C43/58 ; B29C70/48

Abstract:
A resin impregnation measurement device includes a jig and a resin impregnation sensor. The jig is formed into an inner surface shape of a protrusion of a stringer. The jig includes outer surfaces including a facing surface that is to face an inner surface of the protrusion. The resin impregnation sensor is disposed on the facing surface of the jig.
Public/Granted literature
- US20200207037A1 RESIN IMPREGNATION MEASUREMENT DEVICE Public/Granted day:2020-07-02
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