Invention Grant
- Patent Title: Method of manufacturing three-dimensional formed object and three-dimensional forming apparatus
-
Application No.: US16274580Application Date: 2019-02-13
-
Publication No.: US11623392B2Publication Date: 2023-04-11
- Inventor: Kenta Anegawa , Kei Yokota , Daizo Aoyagi
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JPJP2018-024033 20180214
- Main IPC: B29C64/194
- IPC: B29C64/194 ; B29C64/40 ; B29C64/209 ; B29C64/118

Abstract:
A method of manufacturing a three-dimensional formed object includes cutting a material block so as to fabricate a bottom portion that includes an upwardly projecting underlying layer portion. The method also includes forming a molten material into a single layer or a plurality of layers on a top of the underlying layer portion so as to fabricate a first layer portion in contact with the underlying layer portion.
Public/Granted literature
- US20190248069A1 Method Of Manufacturing Three-Dimensional Formed Object And Three-Dimensional Forming Apparatus Public/Granted day:2019-08-15
Information query
IPC分类: