Invention Grant
- Patent Title: Fluid supply apparatus and substrate processing apparatus including the same
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Application No.: US17583653Application Date: 2022-01-25
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Publication No.: US11623853B2Publication Date: 2023-04-11
- Inventor: Kibeom Kil , Dongsoo Lee , Wooram Oh , Sangho Jang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2021-0077000 20210614
- Main IPC: B67B7/18
- IPC: B67B7/18 ; B65B3/14 ; B65B7/28 ; B65B3/18 ; B67C9/00 ; H01L21/67

Abstract:
A fluid supply apparatus includes a container supply holder configured to supply a container to a cap separator using a loading box, the container including a detachable nozzle cap, and configured to store a process fluid, a cap separator configured to receive the container from the loading box and separate the nozzle cap from a container body of the container using a cap clamper and a rotation actuator, the cap clamper configured to clamp and hold the nozzle cap, and the rotation actuator configured to rotate the container body, a fluid supplier configured to supply the process fluid contained in the container body through a fluid supply line, and a controller configured to control the container supply holder, the cap separator, and the fluid supplier.
Public/Granted literature
- US20220396380A1 FLUID SUPPLY APPARATUS AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME Public/Granted day:2022-12-15
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