Invention Grant
- Patent Title: Use of toughness improvers for increasing the maximum linear expansion of single-component heat-curing epoxy resin compositions
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Application No.: US16771748Application Date: 2018-12-18
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Publication No.: US11624013B2Publication Date: 2023-04-11
- Inventor: Urs Rheinegger , Elyes Jendoubi , Dominique Gallo , Christian Krüger
- Applicant: SIKA TECHNOLOGY AG
- Applicant Address: CH Baar
- Assignee: SIKA TECHNOLOGY AG
- Current Assignee: SIKA TECHNOLOGY AG
- Current Assignee Address: CH Baar
- Agency: Oliff PLC
- Priority: EP17208667 20171219
- International Application: PCT/EP2018/085494 WO 20181218
- International Announcement: WO2019/121681 WO 20190627
- Main IPC: C09J163/00
- IPC: C09J163/00 ; C08G18/12 ; C08G18/28 ; C08G18/48 ; C08G18/69 ; C08G18/75 ; C08G59/40
Abstract:
Methods in which toughness improvers based on terminally blocked polyurethane prepolymers are used to increase the maximum linear expansion of single component heat-curing epoxy resin compositions, in particular for joining substrates having different thermal expansion coefficients, in particular in the framework of transport agents or white goods.
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