Invention Grant
- Patent Title: Plate-to-plate connecting structure
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Application No.: US16517368Application Date: 2019-07-19
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Publication No.: US11624384B2Publication Date: 2023-04-11
- Inventor: Fuh-Yuarn Shiau
- Applicant: SY-THERMAL INC.
- Applicant Address: TW New Taipei
- Assignee: SY-THERMAL INC.
- Current Assignee: SY-THERMAL INC.
- Current Assignee Address: TW New Taipei
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Main IPC: F16B5/00
- IPC: F16B5/00

Abstract:
A plate-to-plate connecting structure includes a first plate piece and a second plate piece. The first plate piece and the second plate piece have a first concave/convex connecting side and a second concave/convex connecting side connected with a corresponding concave/convex means; the first concave/convex connecting side has a first top edge and a second bottom edge, and the second concave/convex connecting side has a second top edge and a second bottom edge; the first top edge and the first bottom edge have top concave parts and bottom concave parts; the second top edge and the second bottom edge have top convex parts and bottom convex parts; the top convex parts are protruded into the corresponding top concave parts for forming a mutual blocking status; and the bottom convex parts are protruded into the corresponding bottom concave parts for forming the mutual blocking status.
Public/Granted literature
- US20210018025A1 PLATE-TO-PLATE CONNECTING STRUCTURE Public/Granted day:2021-01-21
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