Invention Grant
- Patent Title: Shuttle valve poppet mechanism
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Application No.: US17380627Application Date: 2021-07-20
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Publication No.: US11624449B2Publication Date: 2023-04-11
- Inventor: Vinay Kumar Tumkur Chandrashekar , Elias Eliot
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Kolisch Hartwell, P.C.
- Main IPC: F16K17/26
- IPC: F16K17/26 ; F15B15/02 ; F16K11/044 ; G05D23/13 ; F16K31/56

Abstract:
An apparatus for directing fluid flow is disclosed, including a valve structure having a chamber, a main port, a first port, and a second port, each of the ports being connected to the chamber. A poppet structure in the chamber is moveable between a first position blocking the first port and a second position blocking the second port. A first compliant member connecting the poppet structure to an inner wall of the chamber, is configured to alternate application of forces to the poppet structure, in opposite directions, between the first and second positions.
Public/Granted literature
- US20230021842A1 SHUTTLE VALVE POPPET MECHANISM Public/Granted day:2023-01-26
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