Invention Grant
- Patent Title: Heat pump and method for controlling operation of boiler based on temperature of fluid
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Application No.: US17184059Application Date: 2021-02-24
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Publication No.: US11624532B2Publication Date: 2023-04-11
- Inventor: Jihyeong Ryu , Eunjun Cho , Minsoo Kim , Youngmin Lee , Hojin Seo
- Applicant: LG ELECTRONICS INC.
- Applicant Address: KR Seoul
- Assignee: LG ELECTRONICS INC.
- Current Assignee: LG ELECTRONICS INC.
- Current Assignee Address: KR Seoul
- Agency: Ked & Associates
- Priority: KR10-2020-0023205 20200225
- Main IPC: F25B49/02
- IPC: F25B49/02 ; F25B30/02 ; F24D17/02 ; F24D12/02 ; F24D19/10

Abstract:
A heat pump may include a compressor configured to compress a refrigerant, a first temperature sensor configured to detect an outdoor temperature, a second temperature sensor provided in heating pipes connected to a heating device that performs indoor heating and configured to detect a temperature of fluid flowing through the heating pipes, an outdoor heat exchanger configured to perform heat exchange between outdoor air and a refrigerant, a third temperature sensor configured to detect a temperature of the outdoor heat exchanger, and a controller. The controller may be configured to: control power to a boiler and/or to the compressor based on sensing values of the first, second, and third temperature sensors, calculate an expected efficiency of the heat pump based on the sensing value of the first temperature sensor and an initial target temperature, and control power to the boiler based on the expected efficiency.
Public/Granted literature
- US20210262708A1 HEAT PUMP AND METHOD OF OPERATING HEAT PUMP Public/Granted day:2021-08-26
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