Invention Grant
- Patent Title: Apparatuses, systems, and methods for heating a memory device
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Application No.: US16779472Application Date: 2020-01-31
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Publication No.: US11625191B2Publication Date: 2023-04-11
- Inventor: Arash Hazeghi , Pranav Kalavade , Rohit Shenoy , Krishna Parat
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: G06F3/06
- IPC: G06F3/06 ; G05B19/406

Abstract:
An apparatus and/or system is described including a memory device or a controller for the memory device to perform heating of the memory device. In embodiments, a controller is to receive a temperature of the memory device and determine that the temperature is below a threshold temperature. In embodiments, the controller activates a heater for one or more memory die to assist the memory device in moving the temperature towards the threshold temperature, to assist the memory device when reading data. In embodiments, the heater comprises a plurality of conductive channels included in the one or more memory die or other on-board heater. Other embodiments are disclosed and claimed.
Public/Granted literature
- US20210240388A1 APPARATUSES, SYSTEMS, AND METHODS FOR HEATING A MEMORY DEVICE Public/Granted day:2021-08-05
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