A package for an integrated circuit is marked with an encoded image (e.g., a two-dimensional barcode). The encoded image is scanned by a scanner to obtain manufacturing parameters. In one approach, a method includes: fabricating, in a manufacturing facility, a physical product using a manufacturing process, where the physical product is fabricated according to specifications, and the manufacturing process includes manufacturing steps performed in the manufacturing facility; marking the physical product with an encoded image, where the encoded image encodes parameters that include the specifications; and transporting the physical product to a storage facility, where the storage facility includes a scanner configured to scan the encoded image to obtain the parameters.