Invention Grant
- Patent Title: Wire harness manufacturing system and wire harness manufacturing method
-
Application No.: US16932675Application Date: 2020-07-17
-
Publication No.: US11626216B2Publication Date: 2023-04-11
- Inventor: Masashi Nakamura , Satoshi Enomoto , Yoshio Shionome , Akiyoshi Kanazawa , Tomokazu Kato
- Applicant: YAZAKI CORPORATION
- Applicant Address: JP Tokyo
- Assignee: YAZAKI CORPORATION
- Current Assignee: YAZAKI CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Kenealy Vaidya LLP
- Priority: JPJP2019-132457 20190718
- Main IPC: H01B13/012
- IPC: H01B13/012 ; B60R16/02 ; G01R31/69
Abstract:
A wire harness manufacturing system includes a conduction inspection device configured to inspect a conductive state at a position of other end of each of a plurality of sub-harnesses in a state that one end of each of the plurality of sub-harnesses is connected to a control box, and an information writing device configured to write terminal information of the plurality of sub-harnesses in a box side storage portion of the control box.
Public/Granted literature
- US20210020336A1 WIRE HARNESS MANUFACTURING SYSTEM AND WIRE HARNESS MANUFACTURING METHOD Public/Granted day:2021-01-21
Information query
