Invention Grant
- Patent Title: Coil assembly
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Application No.: US16274435Application Date: 2019-02-13
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Publication No.: US11626241B2Publication Date: 2023-04-11
- Inventor: Ha Ryong Hong , Ki Won Chang , Geun Young Park
- Applicant: WITS Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: WITS Co., Ltd.
- Current Assignee: WITS Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2018-0112414 20180919
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/29 ; H01F41/04 ; H01F27/32 ; H04B5/00 ; H01F38/14 ; H02J7/02
Abstract:
A coil assembly includes: a connection substrate including a coil pad and an accommodating portion disposed in a position adjacent to the coil pad; and a coil portion including a spiral wiring and an end portion bonded to the coil pad, wherein at least a portion of the coil portion is disposed in the accommodating portion.
Public/Granted literature
- US20200090858A1 COIL ASSEMBLY Public/Granted day:2020-03-19
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