Invention Grant
- Patent Title: Multilayer capacitor
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Application No.: US17399564Application Date: 2021-08-11
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Publication No.: US11626246B2Publication Date: 2023-04-11
- Inventor: Jong Ho Lee , Hong Seok Kim , Dong Chan Kim , Eun Jeong Cho , Chung Eun Lee , Hye Bin Kim , Eun Joo Choi , Sun Ju Hwang
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2020-0142696 20201030
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/12 ; H01G4/10 ; H01G4/232

Abstract:
A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are provided and a plurality of internal electrodes are stacked with the dielectric layer interposed therebetween and external electrodes disposed outside the body and connected to the plurality of internal electrodes. The body includes a high resistance portion disposed in at least one region between the dielectric layer and the internal electrode and inside the dielectric layer and having electric resistance higher than electric resistance of the internal electrode, and the high resistance portion and the plurality of internal electrodes include the same metal component and the same metal oxide component.
Public/Granted literature
- US20220139619A1 MULTILAYER CAPACITOR Public/Granted day:2022-05-05
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