Invention Grant
- Patent Title: Electronic component, circuit board arrangement, and method of manufacturing electronic component
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Application No.: US17458144Application Date: 2021-08-26
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Publication No.: US11626247B2Publication Date: 2023-04-11
- Inventor: Junichi Shinozaki , Toshiki Kondo , Ryosuke Hoshino , Takahisa Fukuda
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JPJP2020-143481 20200827
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/248 ; H01G4/12 ; H05K1/18 ; H01G4/30

Abstract:
An electronic component includes an element body and external electrodes. The element body includes a dielectric and an internal electrode. Each of the external electrodes includes a base layer formed on multiple surfaces of the element body and an electrically-conducting material layer formed on the base layer, the base layer including a metal and co-material particles dispersed in the metal and being connected to the internal electrode. The co-material particles at an interface surface between the base layer and the electrically-conducting material layer have edges covered with the metal at the interface surface. The electrically-conducting material layer is in contact with the co-material particles at the interface surface and the metal covering the edges of the co-material particles at the interface surface.
Public/Granted literature
- US20220068564A1 ELECTRONIC COMPONENT, CIRCUIT BOARD ARRANGEMENT, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT Public/Granted day:2022-03-03
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