Invention Grant
- Patent Title: Wafer holding pins and methods of using the same
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Application No.: US17854361Application Date: 2022-06-30
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Publication No.: US11626300B2Publication Date: 2023-04-11
- Inventor: Chia-Lun Chen , Ming-Sung Hung , Po-Jen Shih , Wen-Hung Hsu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/67 ; H01L21/687 ; B08B3/08 ; B08B3/04
Abstract:
An apparatus includes a substrate stage configured to secure a substrate thereon and a motion mechanism configured to rotate the substrate stage. The substrate stage includes a plurality of holding pins for holding an edge of the substrate. Rotating the substrate stage causes a chemical solution dispensed on an upper surface of the substrate to spread outwardly toward the edge of the substrate. At least one of the plurality of holding pins includes at least one opening or at least one tapered side surface, or both, for guiding the chemical solution to flow off the substrate.
Public/Granted literature
- US20220336236A1 Wafer Holding Pins and Methods of Using the Same Public/Granted day:2022-10-20
Information query
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