Invention Grant
- Patent Title: Bonding method for cleaning non-bonding surface of substrate
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Application No.: US17813369Application Date: 2022-07-19
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Publication No.: US11626302B2Publication Date: 2023-04-11
- Inventor: Yuji Mimura , Hiroshi Maeda , Satoshi Nishimura
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JPJP2019-046314 20190313,JPJP2019-166325 20190912
- Main IPC: H01J9/48
- IPC: H01J9/48 ; H01L21/67 ; H01J37/36 ; H01L21/304 ; H01L21/66 ; G06T7/00 ; H01L21/18 ; H01J37/32 ; B32B37/00 ; B24B7/00 ; B24D3/00
Abstract:
A bonding system includes a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate; a surface hydrophilizing apparatus configured to hydrophilize the modified bonding surface of the first substrate and the modified bonding surface of the second substrate; a bonding apparatus configured to perform bonding of the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate in a state that the bonding surfaces face each other; and a cleaning apparatus configured to clean, before the bonding is performed, a non-bonding surface of, between the first substrate and the second substrate, at least one which is maintained flat when the bonding is performed, the not-bonding surface being opposite to the bonding surface.
Public/Granted literature
- US20220351987A1 BONDING METHOD FOR CLEANING NON-BONDING SURFACE OF SUBSTRATE Public/Granted day:2022-11-03
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