Invention Grant
- Patent Title: Compliance components for semiconductor processing system
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Application No.: US16856262Application Date: 2020-04-23
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Publication No.: US11626303B2Publication Date: 2023-04-11
- Inventor: Viren Kalsekar
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677

Abstract:
Exemplary substrate processing systems may include a chamber body defining a transfer region. The systems may include a first lid plate seated on the chamber body along a first surface of the first lid plate. The first lid plate may define a plurality of apertures through the first lid plate. The systems may include a plurality of lid stacks equal to a number of apertures of the plurality of apertures. The plurality of lid stacks may at least partially define a plurality of processing regions vertically offset from the transfer region. The systems may include a second lid plate coupled with the plurality of lid stacks. The plurality of lid stacks may be positioned between the first lid plate and the second lid plate. A component of each lid stack of the plurality of lid stacks may be coupled with the second lid plate.
Public/Granted literature
- US20210335635A1 COMPLIANCE COMPONENTS FOR SEMICONDUCTOR PROCESSING SYSTEM Public/Granted day:2021-10-28
Information query
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