Invention Grant
- Patent Title: Lift pin assembly, an electrostatic chuck and a processing apparatus where the electrostatic chuck is located
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Application No.: US16538695Application Date: 2019-08-12
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Publication No.: US11626314B2Publication Date: 2023-04-11
- Inventor: Tuqiang Ni , Rubin Ye , Manus Wong , Jie Liang , Leyi Tu , Ziyang Wu
- Applicant: Advanced Micro-Fabrication Equipment Inc. China
- Applicant Address: CN Shanghai
- Assignee: Advanced Micro-Fabrication Equipment Inc. China
- Current Assignee: Advanced Micro-Fabrication Equipment Inc. China
- Current Assignee Address: CN Shanghai
- Agency: Womble Bond Dickinson (US) LLP
- Priority: CN201811064424.9 20180912
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/687 ; H01L21/683 ; H01J37/32 ; H01L21/67
Abstract:
Disclosed are a lift pin assembly, an electrostatic chuck with the lift pin assembly, and a processing apparatus where the electrostatic chuck is located. The lift pin assembly comprises: a lift pin, a lift pin receiving channel connected to a pressure control device, one end of the lift pin receiving channel proximal to a wafer being provided with a sealing ring, an upper surface of the sealing ring being in contact with a back face of the wafer during processing to avoid a gas at the back face of the wafer from entering the lift pin receiving channel, thereby enabling the pressure control device to independently control the pressure in the lift pin receiving channel.
Public/Granted literature
Information query
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