Invention Grant
- Patent Title: Film forming method and film forming apparatus
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Application No.: US17303920Application Date: 2021-06-10
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Publication No.: US11626330B2Publication Date: 2023-04-11
- Inventor: Yuji Otsuki , Munehito Kagaya , Yusuke Suzuki
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Armstrong Teasdale LLP
- Priority: JPJP2020-104779 20200617
- Main IPC: G01N21/35
- IPC: G01N21/35 ; H01L21/66 ; G01N21/3563 ; G01N21/84

Abstract:
A film forming method includes: a first measurement process of measuring a substrate on which a pattern including recesses is formed using infrared spectroscopy; a film formation process of forming a film on the substrate after the first measurement process; a second measurement process of measuring the substrate using infrared spectroscopy after the film formation process; and an extraction process of extracting difference data between measurement data obtained in the first measurement process and measurement data obtained in the second measurement process.
Public/Granted literature
- US20210398863A1 FILM FORMING METHOD AND FILM FORMING APPARATUS Public/Granted day:2021-12-23
Information query
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