Invention Grant
- Patent Title: Package structure
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Application No.: US17702817Application Date: 2022-03-24
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Publication No.: US11626341B2Publication Date: 2023-04-11
- Inventor: Shih-Hui Wang , Der-Chyang Yeh , Shih-Peng Tai , Tsung-Shu Lin , Yi-Chung Huang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L23/13 ; H01L23/00 ; H01L23/498 ; H01L25/065
Abstract:
A package structure includes a substrate, a semiconductor device and an adhesive layer. The semiconductor device is disposed on the substrate, wherein an angle θ is formed between one sidewall of the semiconductor device and one of sides of the substrate, 0°
Public/Granted literature
- US20220216123A1 PACKAGE STRUCTURE Public/Granted day:2022-07-07
Information query
IPC分类:
